METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY

A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the s...

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Hauptverfasser: RATHORE HAZARA SINGH, MCGAHAY VINCENT J, MCLAUGHLIN PAUL STEPHEN, GILL JASON PAUL, SHAW THOMAS M, WANG PINGUAN, FILIPPI RONALD GENE, MURRAY CONAL EUGENE
Format: Patent
Sprache:eng
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Zusammenfassung:A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.