Semiconductor device

A plurality of inner leads 14 are provided around a die pad 13 . A grounded GND lead 16 is provided in a region between the die pad 13 and the plurality of inner leads 14 . A semiconductor chip 17 and the plurality of inner leads 14 are connected to each other by a plurality of wires 21 . The semico...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUKUDOME KATSUYUKI, YASUDA NAOYA, TAKATA YASUKI, MISUMI KAZUYUKI, HATAUCHI KAZUSHI, ARAKAWA HIDEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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