Semiconductor device

Semiconductor device

A plurality of inner leads 14 are provided around a die pad 13 . A grounded GND lead 16 is provided in a region between the die pad 13 and the plurality of inner leads 14 . A semiconductor chip 17 and the plurality of inner leads 14 are connected to each other by a plurality of wires 21 . The semico...

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Bibliographische Detailangaben
Hauptverfasser: FUKUDOME KATSUYUKI, YASUDA NAOYA, TAKATA YASUKI, MISUMI KAZUYUKI, HATAUCHI KAZUSHI, ARAKAWA HIDEYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:A plurality of inner leads 14 are provided around a die pad 13 . A grounded GND lead 16 is provided in a region between the die pad 13 and the plurality of inner leads 14 . A semiconductor chip 17 and the plurality of inner leads 14 are connected to each other by a plurality of wires 21 . The semiconductor chip 17 and the GND lead 16 are connected to each other by GND wires 22 . The GND wires 22 are disposed between a plurality of wires 21 . The distance between ends of each adjacent pair of the inner leads 14 is 0.2 mm or less.