INTERCONNECTING (MAPPING) A TWO-DIMENSIONAL OPTOELECTRONIC (OE) DEVICE ARRAY TO A ONE-DIMENSIONAL WAVEGUIDE ARRAY

For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or...

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Bibliographische Detailangaben
Hauptverfasser: SCHAUB JEREMY D, GUCKENBERGER JOHN A, BUDD RUSSELL A, TREWHELLA JEANNINE M, TAN MICHAEL, CHINIWALLA PUNIT P, KASH JEFFREY A, TROTT GARRY
Format: Patent
Sprache:eng
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Zusammenfassung:For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.