RESILIENT FASTENER AND THERMAL MODULE INCORPORATING THE SAME

A thermal module ( 10 ) includes a fin assembly ( 14 ), a heat pipe ( 16 ) thermally contacting with a heat generating electronic component ( 60 ) disposed on a printed circuit board ( 50 ) and the fin assembly, and a resilient fastener ( 20 ) attaching an evaporation section ( 164 ) of the heat pip...

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Bibliographische Detailangaben
Hauptverfasser:	LIANG SHANGIH, HUNG JUI-WEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CALCULATING COMPUTING COUNTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING PHYSICS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	A thermal module ( 10 ) includes a fin assembly ( 14 ), a heat pipe ( 16 ) thermally contacting with a heat generating electronic component ( 60 ) disposed on a printed circuit board ( 50 ) and the fin assembly, and a resilient fastener ( 20 ) attaching an evaporation section ( 164 ) of the heat pipe to the heat generating electronic component. The fastener includes a mounting element ( 40 ) being attached to the printed circuit board, and an engaging element ( 30 ) embedded in the mounting element. The engaging element includes a base plate ( 32 ) having a first surface contacting with the evaporation section of the heat pipe and a second surface thermally contacting with the heat generating electronic component, and at least a resilient strip ( 34 ) sandwiched between the first surface of the base plate of the engaging element and the mounting element.