SURFACE MOUNT FOOT WITH COINED EDGE SURFACE

A surface mount device having a surface mount foot and a method for making the same is disclosed. The method includes providing a piece of pre-plated conductive stock of a conductive base material and a corrosion-resistant conductive plating material different from the conductive base material at le...

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Bibliographische Detailangaben
Hauptverfasser:	HORST SHELDON LYNN, WILSON JOHN STEVEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A surface mount device having a surface mount foot and a method for making the same is disclosed. The method includes providing a piece of pre-plated conductive stock of a conductive base material and a corrosion-resistant conductive plating material different from the conductive base material at least partially overlying the conductive base material. The stock is cut and formed to create a surface mount device having a surface mount foot extending therefrom. The surface mount foot has a top surface, a plated bottom surface and an at least one unplated side surface intermediate the top and bottom surfaces. The plated bottom surface is swaged to create a new plated coined edge surface intermediate the unplated side surface and the plated bottom surface of the surface mount foot.