INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP OVER VIA

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP OVER VIA

An integrated circuit package system includes a substrate, forming a resist layer having an elongated recess over the substrate, forming a via in the substrate below the elongated recess, and forming an elongated bump in the elongated recess over the via.

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Bibliographische Detailangaben
Hauptverfasser: KIM GWANGJIN, PARK SOOHAN, NA GUICHEA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package system includes a substrate, forming a resist layer having an elongated recess over the substrate, forming a via in the substrate below the elongated recess, and forming an elongated bump in the elongated recess over the via.