Method For Manufacturing Of Electronics Package

A method for manufacturing an electronics package is provided in which a carrier is provided, at least one electronic component is placed on the carrier and a base layer is then deposited on the electronic component(s). The base layer may include a dielectric layer binding the electronic component(s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MOLKKARI PETRI, MANSIKKAMAKI PAULIINA, VALTANEN JANI, MIETTINEN JANI, MANTYSALO MATTI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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