Method For Manufacturing Of Electronics Package

A method for manufacturing an electronics package is provided in which a carrier is provided, at least one electronic component is placed on the carrier and a base layer is then deposited on the electronic component(s). The base layer may include a dielectric layer binding the electronic component(s) to the carrier and providing an adhesive surface for further layers. Alternatively, the base layer may include an electrically conductive layer binding the electronic component(s) to the carrier and providing electromagnetic shielding for the electronic component(s) and an adhesive surface for further layers. A corresponding shield and a computer-readable medium for storing instructions for instructing a computer to perform the manufacturing method are also provided.