Process For Producing A Printed Wiring Board

A printed wiring board comprising an insulating film, a wiring pattern formed on at least one surface of the insulating film, a metal plating layer on the wiring pattern, and a resin protective layer provided on the wiring pattern with the metal plating layer in between so as to expose terminal port...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TERADA HIROMU, SAKATA KEN
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	A printed wiring board comprising an insulating film, a wiring pattern formed on at least one surface of the insulating film, a metal plating layer on the wiring pattern, and a resin protective layer provided on the wiring pattern with the metal plating layer in between so as to expose terminal portions of the wiring pattern plated with the metal, wherein the metal plating layer on the wiring pattern has a surface roughness (Rz) of 1.1 mum or above. A semiconductor device includes the printed wiring board and an electronic component mounted thereon. In production of the printed wiring board, the wiring pattern is surface roughened prior to forming the metal plating layer such that the metal plating layer formed thereon will have a surface roughness (Rz) of 1.1 mum or above.