Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system i...

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Bibliographische Detailangaben
Hauptverfasser:	KODAMA SHOICHI, IMOTO YUKIO, OMICHI TAKASHI, NISHI TOYOMI, YAJIMA HIROMI, TOGAWA TETSUJI, AOKI RIICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY BLASTING CLEANING CLEANING IN GENERAL CODE CONVERSION IN GENERAL CODING DECODING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HEATING LIGHTING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MECHANICAL ENGINEERING PERFORMING OPERATIONS PICTORIAL COMMUNICATION, e.g. TELEVISION POLISHING PREVENTION OF FOULING IN GENERAL RANGES SEMICONDUCTOR DEVICES TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION TRANSPORTING VENTILATING WEAPONS
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Beschreibung
Zusammenfassung:	A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.