Method of Manufacture of Encapsulated Package

There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the expose...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: POH YONG CHERN, HENG CHAI WEI, HENG YANG HONG
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.