Modular sensor assembly and methods of fabricating the same
A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor...
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| creator | WODNICKI ROBERT GIDEON MILLS DAVID MARTIN FISHER RAYETTE ANN ERLBAUM JEFFREY SCOTT COGAN SCOTT ESLER DAVID RICHARD WOYCHIK CHARLES GERARD |
| description | A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2008134793A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2008134793A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2008134793A13</originalsourceid><addsrcrecordid>eNrjZLD2zU8pzUksUihOzSvOL1JILC5OzU3KqVRIzEtRyE0tychPKVbIT1NIS0wqykxOLMnMS1coyUhVKE7MTeVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGBhaGxibmlsaOhsbEqQIAaK4wSw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Modular sensor assembly and methods of fabricating the same</title><source>esp@cenet</source><creator>WODNICKI ROBERT GIDEON ; MILLS DAVID MARTIN ; FISHER RAYETTE ANN ; ERLBAUM JEFFREY SCOTT ; COGAN SCOTT ; ESLER DAVID RICHARD ; WOYCHIK CHARLES GERARD</creator><creatorcontrib>WODNICKI ROBERT GIDEON ; MILLS DAVID MARTIN ; FISHER RAYETTE ANN ; ERLBAUM JEFFREY SCOTT ; COGAN SCOTT ; ESLER DAVID RICHARD ; WOYCHIK CHARLES GERARD</creatorcontrib><description>A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.</description><language>eng</language><subject>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC ORINFRASONIC WAVES ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE ; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR ; PHYSICS ; TARIFF METERING APPARATUS ; TESTING</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080612&DB=EPODOC&CC=US&NR=2008134793A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080612&DB=EPODOC&CC=US&NR=2008134793A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WODNICKI ROBERT GIDEON</creatorcontrib><creatorcontrib>MILLS DAVID MARTIN</creatorcontrib><creatorcontrib>FISHER RAYETTE ANN</creatorcontrib><creatorcontrib>ERLBAUM JEFFREY SCOTT</creatorcontrib><creatorcontrib>COGAN SCOTT</creatorcontrib><creatorcontrib>ESLER DAVID RICHARD</creatorcontrib><creatorcontrib>WOYCHIK CHARLES GERARD</creatorcontrib><title>Modular sensor assembly and methods of fabricating the same</title><description>A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.</description><subject>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC ORINFRASONIC WAVES</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE</subject><subject>MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR</subject><subject>PHYSICS</subject><subject>TARIFF METERING APPARATUS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD2zU8pzUksUihOzSvOL1JILC5OzU3KqVRIzEtRyE0tychPKVbIT1NIS0wqykxOLMnMS1coyUhVKE7MTeVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGBhaGxibmlsaOhsbEqQIAaK4wSw</recordid><startdate>20080612</startdate><enddate>20080612</enddate><creator>WODNICKI ROBERT GIDEON</creator><creator>MILLS DAVID MARTIN</creator><creator>FISHER RAYETTE ANN</creator><creator>ERLBAUM JEFFREY SCOTT</creator><creator>COGAN SCOTT</creator><creator>ESLER DAVID RICHARD</creator><creator>WOYCHIK CHARLES GERARD</creator><scope>EVB</scope></search><sort><creationdate>20080612</creationdate><title>Modular sensor assembly and methods of fabricating the same</title><author>WODNICKI ROBERT GIDEON ; MILLS DAVID MARTIN ; FISHER RAYETTE ANN ; ERLBAUM JEFFREY SCOTT ; COGAN SCOTT ; ESLER DAVID RICHARD ; WOYCHIK CHARLES GERARD</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2008134793A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC ORINFRASONIC WAVES</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE</topic><topic>MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR</topic><topic>PHYSICS</topic><topic>TARIFF METERING APPARATUS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WODNICKI ROBERT GIDEON</creatorcontrib><creatorcontrib>MILLS DAVID MARTIN</creatorcontrib><creatorcontrib>FISHER RAYETTE ANN</creatorcontrib><creatorcontrib>ERLBAUM JEFFREY SCOTT</creatorcontrib><creatorcontrib>COGAN SCOTT</creatorcontrib><creatorcontrib>ESLER DAVID RICHARD</creatorcontrib><creatorcontrib>WOYCHIK CHARLES GERARD</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WODNICKI ROBERT GIDEON</au><au>MILLS DAVID MARTIN</au><au>FISHER RAYETTE ANN</au><au>ERLBAUM JEFFREY SCOTT</au><au>COGAN SCOTT</au><au>ESLER DAVID RICHARD</au><au>WOYCHIK CHARLES GERARD</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Modular sensor assembly and methods of fabricating the same</title><date>2008-06-12</date><risdate>2008</risdate><abstract>A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC ORINFRASONIC WAVES MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING |
| title | Modular sensor assembly and methods of fabricating the same |
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