Modular sensor assembly and methods of fabricating the same

A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor...

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Bibliographische Detailangaben
Hauptverfasser:	WODNICKI ROBERT GIDEON, MILLS DAVID MARTIN, FISHER RAYETTE ANN, ERLBAUM JEFFREY SCOTT, COGAN SCOTT, ESLER DAVID RICHARD, WOYCHIK CHARLES GERARD
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC ORINFRASONIC WAVES MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.