APPARATUS FOR DEPOSITING THIN FILM AND METHOD OF DEPOSITING THE SAME

Provided are an apparatus for depositing a thin film using plasma which can prevent impurities from being formed by inhibiting plasma from being diffused into a nozzle pipe and sustained in the nozzle pipe and improve thickness uniformity of the deposited thin film and a method of depositing the sam...

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Bibliographische Detailangaben
Hauptverfasser: LEE HEOK-JAE, CHO SE-HWI, CHO JUNG-HUN, YANG YUN-SIK, LIM YONG-GYU
Format: Patent
Sprache:eng
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Zusammenfassung:Provided are an apparatus for depositing a thin film using plasma which can prevent impurities from being formed by inhibiting plasma from being diffused into a nozzle pipe and sustained in the nozzle pipe and improve thickness uniformity of the deposited thin film and a method of depositing the same. The apparatus for depositing a thin film includes a chamber having a substrate holder and an inner space defined by an inner wall; and a nozzle pipe comprising a first end fixed to the inner wall of the chamber; a second end extending into the inner space of the chamber; a flow path penetrating the nozzle pipe from the first end to the second end; and at least one slit which is disposed at the second end and opens the flow path into the inner space of the chamber.