Ink compositions and methods of use thereof

Disclosed herein are rapid radiation curable ink compositions that can cure at speeds that are greater than the speeds at which other commercially available ink compositions cure. The rapidly curing ink compositions advantageously display an increased cure speed, improved adhesion and solvent resist...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ELLISON MATTHEW M, EDISON SARA E, NAGVEKAR DEVDATT S, MADHUSOODHANAN SUDHAKAR, WILSON DANIEL A
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	Disclosed herein are rapid radiation curable ink compositions that can cure at speeds that are greater than the speeds at which other commercially available ink compositions cure. The rapidly curing ink compositions advantageously display an increased cure speed, improved adhesion and solvent resistance when compared with other commercially available compositions. The ink compositions of the invention are substantially free of solvent, and include an ethylenically unsaturated hyperbranched oligomer having an average functionality of at least 6 per oligomer, a difunctional ethylenically unsaturated compound, and a photoinitiator. The ink compositions optionally include a surfactant and/or a vinyl amide monomer.