Processing of a CMP slurry for improved planarization of integrated circuit wafers

The disclosure is directed to a system that processes chemical mechanical planarization (CMP) slurries to reduce or eliminate large particles in the slurries, which can scratch integrated circuit wafers without substantially altering a percentage of solids in the CMP slurry by weight. In particular,...

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Bibliographische Detailangaben
Hauptverfasser:	NELSON NEAL K, SERAFIN MARK, OLMSTED RICHARD D
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	The disclosure is directed to a system that processes chemical mechanical planarization (CMP) slurries to reduce or eliminate large particles in the slurries, which can scratch integrated circuit wafers without substantially altering a percentage of solids in the CMP slurry by weight. In particular, the system breaks up particles of a CMP slurry using an intensifier pump system and a fluid processing device. The techniques have proven much more effective than conventional filtering techniques in reducing or eliminating scratches to integrated circuit wafers when a processed CMP slurry is used in a CMP process.