CHEMICAL MECHANICAL POLISHING WITH NAPPED POROMERIC

A method of polishing a substrate includes polishing a substrate with a generally linear polishing sheet, polishing the substrate with polishing pad composed of a napped poromeric material, and conditioning the polishing pad.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ROSENBERG LAWRENCE M, BIRANG MANOOCHER, SOMEKH SASSON, WHITE JOHN M
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method of polishing a substrate includes polishing a substrate with a generally linear polishing sheet, polishing the substrate with polishing pad composed of a napped poromeric material, and conditioning the polishing pad.