Amide-Substituted Silicones and Methods for their Preparation and Use

A composition includes: (A) an amide-substituted silicone and (B) a thermally conductive filler. The composition may be used as a thermal interface material for dissipating heat from electronic devices.

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Bibliographische Detailangaben
Hauptverfasser:	ZHONG BIANXIAO, LIN ZUCHEN
Format:	Patent
Sprache:	eng
Schlagworte:	ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM CHEMISTRY COMPOSITIONS BASED THEREON FUELS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LUBRICANTS LUBRICATING COMPOSITIONS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PEAT PERFORMING OPERATIONS PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MONOXIDE THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATINGINGREDIENTS IN A LUBRICATING COMPOSITION
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Beschreibung
Zusammenfassung:	A composition includes: (A) an amide-substituted silicone and (B) a thermally conductive filler. The composition may be used as a thermal interface material for dissipating heat from electronic devices.