Method of dicing polycrystalline silicon solar cell wafer

A method to dice polycrystalline silicon into solar cell wafer by following grain growth direction of crystal so to allow larger grains to present on a surface of the solar cell wafer to reduce the grain number per unit area on the surface of the solar cell wafer and/or photo transfer interface; i.e...

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Bibliographische Detailangaben
Hauptverfasser:	YEH JER-LIANG A, HSU WENING, HO YA-LAN, YANG MING-SUNG, LEE CHIEN-HSIEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A method to dice polycrystalline silicon into solar cell wafer by following grain growth direction of crystal so to allow larger grains to present on a surface of the solar cell wafer to reduce the grain number per unit area on the surface of the solar cell wafer and/or photo transfer interface; i.e., to reduce potential barrier and resistance created among grains; whereas extra foreign matters in the boundary will compromise photo transfer efficiency and electronic migration capability of the substrate surrounding the boundary, reduced number of boundary in turn upgrade photo transfer efficiency.