INTEGRATED CIRCUIT SYSTEM WITH CONTACT FILM

A integrated circuit system including providing an integrated circuit device, forming an undoped insulating layer over the integrated circuit device, forming a thin insulating layer over the undoped insulating layer, forming a doped insulating layer over the thin insulating layer, and forming a cont...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YONG CHIH PING, YEAP CHUIN BOON, ROSSI NACE, SINGH RANBIR, CHEW PETER, LIM JOVIN, YAP HOON LIAN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A integrated circuit system including providing an integrated circuit device, forming an undoped insulating layer over the integrated circuit device, forming a thin insulating layer over the undoped insulating layer, forming a doped insulating layer over the thin insulating layer, and forming a contact in the undoped insulating layer, thin insulating layer and the doped insulating layer.