INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FILLED RECESS

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FILLED RECESS

An integrated circuit package system is provided including forming a wafer having a back side and an active side, forming a recess in the wafer from the back side, forming a cover in the recess, and singulating the wafer at the recess filled with the cover.

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Bibliographische Detailangaben
Hauptverfasser: MAGNO SHEILA RIMA C, GUILLERMO DENNIS, ASOY MA. SHIRLEY, MARIMUTHU PANDI CHELVAM
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit package system is provided including forming a wafer having a back side and an active side, forming a recess in the wafer from the back side, forming a cover in the recess, and singulating the wafer at the recess filled with the cover.