SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

In various embodiments, semiconductor components and methods to manufacture semiconductor components are disclosed. In one embodiment, a semiconductor component includes a semiconductor die and multiple coplanar leads coupled to the semiconductor die, wherein the semiconductor die includes a power transistor and wherein the multiple leads are spaced apart from each other by a distance of about 0.1 millimeters (mm) or less. The semiconductor components further include a packaging material encapsulating the semiconductor die, wherein the packaging material is formed between the leads to electrically isolate the leads from each other. Other embodiments are described and claimed.