CORROSION RESISTANT WAFER PROCESSING APPARATUS AND METHOD FOR MAKING THEREOF

A wafer processing apparatus characterized by having corrosion resistant connections for its electrical connections, gas feed-through channels, recessed areas, raised areas, MESA, through-holes such as lift-pin holes, threaded bolt holes, blind holes, and the like, with the special configurations em...

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Bibliographische Detailangaben
Hauptverfasser: RUSINKO DAVID M, FAN WEI, LONGWORTH DOUGLAS A, SCHAEPKENS MARC, OLECHNOWICZ BENJAMIN J, SARIGIANNIS DEMETRIUS
Format: Patent
Sprache:eng
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Zusammenfassung:A wafer processing apparatus characterized by having corrosion resistant connections for its electrical connections, gas feed-through channels, recessed areas, raised areas, MESA, through-holes such as lift-pin holes, threaded bolt holes, blind holes, and the like, with the special configurations employing connectors and fillers having excellent chemical resistant properties and optimized CTEs, i.e., having a coefficient of thermal expansion (CTE) that closely matches the CTE of the base substrate layer, the electrode(s), as well as the CTE of coating layer. In one embodiment, a nickel plated molybdenum insert is employed.