Method for increasing a production rate of printed wiring boards

A method for increasing a production rate of printed wiring boards has the following steps: applying a conductive layer to an isolating base board; drilling at least one first conductive layer and the isolating base board to form multiple through holes; plating the through holes with a conductive ma...

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Bibliographische Detailangaben
Hauptverfasser:	TSAI WEN-REN, CHEN SHUNGIN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method for increasing a production rate of printed wiring boards has the following steps: applying a conductive layer to an isolating base board; drilling at least one first conductive layer and the isolating base board to form multiple through holes; plating the through holes with a conductive material to form an inner conductive layer; implementing a plating process; plating the set of wires with a conductive material such as copper to form a third conductive layer and thereby increasing a width of each wiring and shorten a distance between adjacent wires; and applying a solder resist on portions of the wires. The method of the invention maintains the width of the wiring in an appropriate value by plating the wiring. Therefore, the quality and the production rate of printed wiring boards are improved.