PRESSURIZED OXYGEN FOR EVALUATION OF MOLDING COMPOUND STABILITY IN SEMICONDUCTOR PACKAGING

PRESSURIZED OXYGEN FOR EVALUATION OF MOLDING COMPOUND STABILITY IN SEMICONDUCTOR PACKAGING

A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WILSON CHARLES H, SCILLA GERALD J, MAHONEY ADELE M, COMEAU JOSEPH K.V, RITTER JASON P
Format: Patent
Sprache:eng
Schlagworte:
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TESTING
TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES
TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
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Beschreibung
Zusammenfassung:A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.