Two Packages Type Thermosetting Resin Composition, Film Forming Method and Coated Article

The great decrease of the curing time (in particular, halving) of acid/epoxy curing system paint and the further improvement of other performances (in particular, film performance). A two packages type thermosetting resin composition comprising (a) an acid anhydride group-containing acryl resin havi...

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Bibliographische Detailangaben
Hauptverfasser: TSUJIOKA HIDEAKI, TANABE HISAKI
Format: Patent
Sprache:eng
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Zusammenfassung:The great decrease of the curing time (in particular, halving) of acid/epoxy curing system paint and the further improvement of other performances (in particular, film performance). A two packages type thermosetting resin composition comprising (a) an acid anhydride group-containing acryl resin having an acid anhydride group of 0.08 to 5.3 mmol/g (solid content) and a number average molecular weight of 500 to 8000 that is obtained by copolymerizing an acid anhydride group-containing ethylenically unsaturated monomer with an ethylenically unsaturated monomer having no acid anhydride group, (b) a carboxylic group-containing polyester resin having a carboxylic group of 0.8 to 6.3 mmol/g (solid content) and a number average molecular weight of 400 to 3500 and a ratio of weight average molecular weight to number average molecular weight of 1.8 or less that is obtained by reacting an acid anhydride group-containing ethylenically unsaturated monomer with polyester polyol having 3 or more of hydroxyl groups, and (c) an acryl resin with hydroxyl groups and epoxy groups having a hydroxyl group of 0.08 to 5.4 mmol/g (solid content), an epoxy group of 1.2 to 10.0 mmol/g (solid content) and a number average molecular weight of 200 to 10000 that is obtained by copolymerizing a hydroxyl group-containing ethylenically unsaturated monomer and an epoxy group-containing ethylenically unsaturated monomer with an ethylenically unsaturated monomer not having a hydroxyl group and an epoxy group.