Surface roughness reduction for improving bonding in ultrasonic consolidation rapid manufacturing

A method for enhancing the bonding and linear weld density along the interface of material layers deposited in accordance with an ultrasonic consolidation manufacturing process, the method comprising: initiating an ultrasonic consolidation manufacturing process; depositing a first material layer hav...

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Bibliographische Detailangaben
Hauptverfasser:	GABBITA DURGA J.R, STUCKER BRENT E
Format:	Patent
Sprache:	eng
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for enhancing the bonding and linear weld density along the interface of material layers deposited in accordance with an ultrasonic consolidation manufacturing process, the method comprising: initiating an ultrasonic consolidation manufacturing process; depositing a first material layer having a contact surface; reducing surface roughness of the contact surface to prepare the contact surface to receive a subsequent material layer, the step of reducing facilitating an increased percentage and quality of material contact between the first and subsequent material layers; and bonding a subsequent material layer to the contact surface of the first material layer, as prepared.