Heat-Activable, Pressure-Sensitive Adhesive Mass

The invention relates to a heat-activable pressure-sensitive adhesive. Provision is made for this heat-activable pressure-sensitive adhesive to comprise a polymer or copolymer formed from a monomer composition comprising at least 50% by weight of a compound of the formula CH2-CH(R1)(COOR2), wherein...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HUSEMANN MARC, ZOLLNER STEPHAN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a heat-activable pressure-sensitive adhesive. Provision is made for this heat-activable pressure-sensitive adhesive to comprise a polymer or copolymer formed from a monomer composition comprising at least 50% by weight of a compound of the formula CH2-CH(R1)(COOR2), wherein R1 represents H or CH3 and R2 represents H or an alkyl chain having 1 to 30 carbon atoms, the polymer or copolymer having a static glass transition temperature of -10° C. to 120° C.; a temperature activation range of 15° C. or less; and a molecular weight distribution Mw/Mn of 2.5 or less.