Air cavity wafer level packaging assembly and method

A wafer level packaging method and assembly for packaging a wafer segment having active and inactive areas. A sacrificial layer is provided over the wafer segment. Then the sacrificial layer is modified to create a sacrificial structure having sacrificial layer openings which expose inactive areas....

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	GEORGE STEPHEN, BRISKIN GALINA, IOURIEVITCH IGOR GENRIKH, NAZARALI KARIM, KOO KENNETH YEE CHING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A wafer level packaging method and assembly for packaging a wafer segment having active and inactive areas. A sacrificial layer is provided over the wafer segment. Then the sacrificial layer is modified to create a sacrificial structure having sacrificial layer openings which expose inactive areas. A cover layer is then deposited over the sacrificial structure such that the cover layer encloses the sacrificial structure and fills the sacrificial layer openings. The cover layer is modified to create a cover structure having cover layer openings that expose an inactive area of the wafer segment and through which the sacrificial structure can be removed. The sacrificial structure is removed and then enclosed with a sealing layer such that the sealing layer fills the cover layer openings in the cover structure. The cover structure and the sealing layer form the packaging assembly for the wafer segment.