SYSTEM IN PACKAGE MODULE

A System in Package (SIP) module. The module includes a printed circuit board with at least one cavity formed therein. The module also includes at least one first device mounted in the cavity and a circuit pattern formed on an undersurface of the cavity and electrically connected to the first device...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YIM NAM GYUN, LEE YONG BUM
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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