SYSTEM IN PACKAGE MODULE

SYSTEM IN PACKAGE MODULE

A System in Package (SIP) module. The module includes a printed circuit board with at least one cavity formed therein. The module also includes at least one first device mounted in the cavity and a circuit pattern formed on an undersurface of the cavity and electrically connected to the first device...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YIM NAM GYUN, LEE YONG BUM
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A System in Package (SIP) module. The module includes a printed circuit board with at least one cavity formed therein. The module also includes at least one first device mounted in the cavity and a circuit pattern formed on an undersurface of the cavity and electrically connected to the first device. The module further includes at least one second device mounted on a printed circuit board surface corresponding to the undersurface of the cavity.