WIRE BONDING PROCESS FOR INSULATED WIRES

A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic flame-of...

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Bibliographische Detailangaben
Hauptverfasser:	RAMKUMAR MALLIAH, SONG YOUNG-KYU, LYN ROBERT, VATH CHARLES J.III, PERSIC JOHN, CARR CHRISTOPHER, LIM LOON A
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR MAKING BEVERAGES COFFEE MILLS DOMESTIC ARTICLES OR APPLIANCES FURNITURE HUMAN NECESSITIES KITCHEN EQUIPMENT SPICE MILLS SUCTION CLEANERS IN GENERAL
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Beschreibung
Zusammenfassung:	A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic flame-off device to melt the tip of the insulated wire and produce a pilot ball. The electric discharge is then terminated. A second electric discharge is then generated to produce the conforming free air ball, and thereafter, the conforming free air ball is attached to a bonding surface to create the ball bond.