Tape with Built-In Ic Chip, Production Method Thereof, and Sheet with Built-In Ic Chip

The present invention relates to a sheet with at least one built-in IC chip, the sheet being scarcely influenced by a mechanical external force and being free from loss or damage of the IC chip, and relates to a tape with at least one built-in IC chip used for the sheet with at least one built-in IC...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OZAKI TUYOSHI, KOBAYASHI HIDEKI, TOMITA KEITARO, KANDA NOBUO, UTAKA KEIICHI, SUGIMURA SHIRO, SAITO MITUGI, AYAKI MITSUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	AGRICULTURE ANIMAL HUSBANDRY CARE OF BIRDS, FISHES, INSECTS CONVEYING FISHING FORESTRY HANDLING THIN OR FILAMENTARY MATERIAL HUMAN NECESSITIES HUNTING LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES NEW BREEDS OF ANIMALS PACKING PERFORMING OPERATIONS REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR STORING TRANSPORTING TRAPPING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a sheet with at least one built-in IC chip, the sheet being scarcely influenced by a mechanical external force and being free from loss or damage of the IC chip, and relates to a tape with at least one built-in IC chip used for the sheet with at least one built-in IC chip. The tape with at least one built-in IC chip is characterized in that a part or all of the IC chip 10 is embedded in a recessed portion 20 a formed on a tape body, and the tape body 20 includes: a first base material 21 ; an adhesive layer 22 laminated on the first base material and formed of an adhesive; and a second base material 23 laminated on the adhesive layer; the second base material 23 being removed from the recessed portion 20 a and the periphery thereof, and the adhesive in the recessed portion 20 a of the adhesive layer 22 being pushed to the periphery thereof, and the pushed adhesive filling in a gap between the periphery of the IC chip 10 and the second base material 23.