Apparatus and method for high utilization of process chambers of a cluster system through staggered plasma cleaning

A method for processing a plurality of substrates in a processing system having four or more process chambers is provided. Each substrate is processed in at least four of the four or more process chambers. Each of the four or more process chambers is cleaned after processing fifteen or less substrat...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TAKEHARA TAKAKO, HUANG INCHEN, WHITE JOHN M
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator TAKEHARA TAKAKO
HUANG INCHEN
WHITE JOHN M
description A method for processing a plurality of substrates in a processing system having four or more process chambers is provided. Each substrate is processed in at least four of the four or more process chambers. Each of the four or more process chambers is cleaned after processing fifteen or less substrates, wherein cleaning of each chamber is scheduled at distinct, non-overlapping time periods to enhance throughput of the substrates through the processing system.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2007254112A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2007254112A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2007254112A13</originalsourceid><addsrcrecordid>eNqNi7sKwkAQANNYiPoPC9ZCEhXrIIq9Wof1srk7uBe3e4V-vQn4AVYDw8yy4i4lzCiFAcMAnsTEAcaYwVhtoIh19oNiY4A4QspRETMog_5FmWeHoFxhoQz8nuBBTI5lellQa8o0QHLIfu4Igw16XS1GdEybH1fV9np5nG87SrEnTqgokPTPe1vXp_Z4aJq2a_b_VV91ikWy</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Apparatus and method for high utilization of process chambers of a cluster system through staggered plasma cleaning</title><source>esp@cenet</source><creator>TAKEHARA TAKAKO ; HUANG INCHEN ; WHITE JOHN M</creator><creatorcontrib>TAKEHARA TAKAKO ; HUANG INCHEN ; WHITE JOHN M</creatorcontrib><description>A method for processing a plurality of substrates in a processing system having four or more process chambers is provided. Each substrate is processed in at least four of the four or more process chambers. Each of the four or more process chambers is cleaned after processing fifteen or less substrates, wherein cleaning of each chamber is scheduled at distinct, non-overlapping time periods to enhance throughput of the substrates through the processing system.</description><language>eng</language><subject>CLEANING ; CLEANING IN GENERAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PLASMA TECHNIQUE ; PREVENTION OF FOULING IN GENERAL ; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS ; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS ; TRANSPORTING</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20071101&amp;DB=EPODOC&amp;CC=US&amp;NR=2007254112A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20071101&amp;DB=EPODOC&amp;CC=US&amp;NR=2007254112A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEHARA TAKAKO</creatorcontrib><creatorcontrib>HUANG INCHEN</creatorcontrib><creatorcontrib>WHITE JOHN M</creatorcontrib><title>Apparatus and method for high utilization of process chambers of a cluster system through staggered plasma cleaning</title><description>A method for processing a plurality of substrates in a processing system having four or more process chambers is provided. Each substrate is processed in at least four of the four or more process chambers. Each of the four or more process chambers is cleaned after processing fifteen or less substrates, wherein cleaning of each chamber is scheduled at distinct, non-overlapping time periods to enhance throughput of the substrates through the processing system.</description><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PLASMA TECHNIQUE</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</subject><subject>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7sKwkAQANNYiPoPC9ZCEhXrIIq9Wof1srk7uBe3e4V-vQn4AVYDw8yy4i4lzCiFAcMAnsTEAcaYwVhtoIh19oNiY4A4QspRETMog_5FmWeHoFxhoQz8nuBBTI5lellQa8o0QHLIfu4Igw16XS1GdEybH1fV9np5nG87SrEnTqgokPTPe1vXp_Z4aJq2a_b_VV91ikWy</recordid><startdate>20071101</startdate><enddate>20071101</enddate><creator>TAKEHARA TAKAKO</creator><creator>HUANG INCHEN</creator><creator>WHITE JOHN M</creator><scope>EVB</scope></search><sort><creationdate>20071101</creationdate><title>Apparatus and method for high utilization of process chambers of a cluster system through staggered plasma cleaning</title><author>TAKEHARA TAKAKO ; HUANG INCHEN ; WHITE JOHN M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2007254112A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PLASMA TECHNIQUE</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</topic><topic>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEHARA TAKAKO</creatorcontrib><creatorcontrib>HUANG INCHEN</creatorcontrib><creatorcontrib>WHITE JOHN M</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEHARA TAKAKO</au><au>HUANG INCHEN</au><au>WHITE JOHN M</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Apparatus and method for high utilization of process chambers of a cluster system through staggered plasma cleaning</title><date>2007-11-01</date><risdate>2007</risdate><abstract>A method for processing a plurality of substrates in a processing system having four or more process chambers is provided. Each substrate is processed in at least four of the four or more process chambers. Each of the four or more process chambers is cleaned after processing fifteen or less substrates, wherein cleaning of each chamber is scheduled at distinct, non-overlapping time periods to enhance throughput of the substrates through the processing system.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2007254112A1
source esp@cenet
subjects CLEANING
CLEANING IN GENERAL
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PLASMA TECHNIQUE
PREVENTION OF FOULING IN GENERAL
PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS
PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS
TRANSPORTING
title Apparatus and method for high utilization of process chambers of a cluster system through staggered plasma cleaning
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T18%3A07%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAKEHARA%20TAKAKO&rft.date=2007-11-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2007254112A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true