Apparatus and method for high utilization of process chambers of a cluster system through staggered plasma cleaning

A method for processing a plurality of substrates in a processing system having four or more process chambers is provided. Each substrate is processed in at least four of the four or more process chambers. Each of the four or more process chambers is cleaned after processing fifteen or less substrat...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEHARA TAKAKO, HUANG INCHEN, WHITE JOHN M
Format:	Patent
Sprache:	eng
Schlagworte:	CLEANING CLEANING IN GENERAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PLASMA TECHNIQUE PREVENTION OF FOULING IN GENERAL PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for processing a plurality of substrates in a processing system having four or more process chambers is provided. Each substrate is processed in at least four of the four or more process chambers. Each of the four or more process chambers is cleaned after processing fifteen or less substrates, wherein cleaning of each chamber is scheduled at distinct, non-overlapping time periods to enhance throughput of the substrates through the processing system.