Method and device of manufacturing thin substrate

An easy and low-cost method of manufacturing a thin substrate reduced in surface wobbling by bonding two thin sheets together is provided. A step of bonding thin substrate sheets together is performed by using a device in which a spacer is incorporated into a turntable provided with a through-hole f...

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Bibliographische Detailangaben
1. Verfasser:	IDO HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An easy and low-cost method of manufacturing a thin substrate reduced in surface wobbling by bonding two thin sheets together is provided. A step of bonding thin substrate sheets together is performed by using a device in which a spacer is incorporated into a turntable provided with a through-hole for air inflow. The thin substrate sheets are rotated on the turntable, to spin off and cure an adhesive for bonding.