Thermal management system and associated method

A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a...

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Bibliographische Detailangaben
Hauptverfasser: MILLS RYAN C, ZHANG JIAN, GOWDA ARUN V, TONAPI SANDEEP S
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.