Methods And Systems For Forming Slots In A Semiconductor Substrate
The described embodiments relate to methods and systems of forming slots in a semiconductor substrate. In one exemplary embodiment, a slot is formed by cutting with a disk into a semiconductor substrate into one of a first and second surfaces. A trench is created in the semiconductor substrate into...
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| creator | KHAVARL MAHRGAN TEMPLIN PAUL BUSWELL SHEN MACKENZLE MARK H RIVAS RIO T JENSSEN CONRAD |
| description | The described embodiments relate to methods and systems of forming slots in a semiconductor substrate. In one exemplary embodiment, a slot is formed by cutting with a disk into a semiconductor substrate into one of a first and second surfaces. A trench is created in the semiconductor substrate into the other of the first and second surfaces to form in combination with said cutting a slot through the substrate. |
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In one exemplary embodiment, a slot is formed by cutting with a disk into a semiconductor substrate into one of a first and second surfaces. A trench is created in the semiconductor substrate into the other of the first and second surfaces to form in combination with said cutting a slot through the substrate.</description><language>eng</language><subject>CORRECTION OF TYPOGRAPHICAL ERRORS ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; PERFORMING OPERATIONS ; PRINTING ; PUNCHING METAL ; SELECTIVE PRINTING MECHANISMS ; STAMPS ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TRANSPORTING ; TYPEWRITERS ; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071018&DB=EPODOC&CC=US&NR=2007240309A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071018&DB=EPODOC&CC=US&NR=2007240309A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KHAVARL MAHRGAN</creatorcontrib><creatorcontrib>TEMPLIN PAUL</creatorcontrib><creatorcontrib>BUSWELL SHEN</creatorcontrib><creatorcontrib>MACKENZLE MARK H</creatorcontrib><creatorcontrib>RIVAS RIO T</creatorcontrib><creatorcontrib>JENSSEN CONRAD</creatorcontrib><title>Methods And Systems For Forming Slots In A Semiconductor Substrate</title><description>The described embodiments relate to methods and systems of forming slots in a semiconductor substrate. In one exemplary embodiment, a slot is formed by cutting with a disk into a semiconductor substrate into one of a first and second surfaces. A trench is created in the semiconductor substrate into the other of the first and second surfaces to form in combination with said cutting a slot through the substrate.</description><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINING MACHINES</subject><subject>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTING</subject><subject>PUNCHING METAL</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>STAMPS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><subject>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDyTS3JyE8pVnDMS1EIriwuSc0tVnDLLwLh3My8dIXgnPySYgXPPAVHheDU3Mzk_LyU0uQSoILg0qTikqLEklQeBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhIfGmxkYGBuZGJgbGDpaGhMnCoAnAgyNA</recordid><startdate>20071018</startdate><enddate>20071018</enddate><creator>KHAVARL MAHRGAN</creator><creator>TEMPLIN PAUL</creator><creator>BUSWELL SHEN</creator><creator>MACKENZLE MARK H</creator><creator>RIVAS RIO T</creator><creator>JENSSEN CONRAD</creator><scope>EVB</scope></search><sort><creationdate>20071018</creationdate><title>Methods And Systems For Forming Slots In A Semiconductor Substrate</title><author>KHAVARL MAHRGAN ; TEMPLIN PAUL ; BUSWELL SHEN ; MACKENZLE MARK H ; RIVAS RIO T ; JENSSEN CONRAD</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2007240309A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINING MACHINES</topic><topic>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTING</topic><topic>PUNCHING METAL</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>STAMPS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><topic>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</topic><toplevel>online_resources</toplevel><creatorcontrib>KHAVARL MAHRGAN</creatorcontrib><creatorcontrib>TEMPLIN PAUL</creatorcontrib><creatorcontrib>BUSWELL SHEN</creatorcontrib><creatorcontrib>MACKENZLE MARK H</creatorcontrib><creatorcontrib>RIVAS RIO T</creatorcontrib><creatorcontrib>JENSSEN CONRAD</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KHAVARL MAHRGAN</au><au>TEMPLIN PAUL</au><au>BUSWELL SHEN</au><au>MACKENZLE MARK H</au><au>RIVAS RIO T</au><au>JENSSEN CONRAD</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Methods And Systems For Forming Slots In A Semiconductor Substrate</title><date>2007-10-18</date><risdate>2007</risdate><abstract>The described embodiments relate to methods and systems of forming slots in a semiconductor substrate. In one exemplary embodiment, a slot is formed by cutting with a disk into a semiconductor substrate into one of a first and second surfaces. A trench is created in the semiconductor substrate into the other of the first and second surfaces to form in combination with said cutting a slot through the substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CORRECTION OF TYPOGRAPHICAL ERRORS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PRINTING PUNCHING METAL SELECTIVE PRINTING MECHANISMS STAMPS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING TYPEWRITERS WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL |
| title | Methods And Systems For Forming Slots In A Semiconductor Substrate |
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