Methods And Systems For Forming Slots In A Semiconductor Substrate

The described embodiments relate to methods and systems of forming slots in a semiconductor substrate. In one exemplary embodiment, a slot is formed by cutting with a disk into a semiconductor substrate into one of a first and second surfaces. A trench is created in the semiconductor substrate into...

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Bibliographische Detailangaben
Hauptverfasser:	KHAVARL MAHRGAN, TEMPLIN PAUL, BUSWELL SHEN, MACKENZLE MARK H, RIVAS RIO T, JENSSEN CONRAD
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PRINTING PUNCHING METAL SELECTIVE PRINTING MECHANISMS STAMPS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING TYPEWRITERS WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Beschreibung
Zusammenfassung:	The described embodiments relate to methods and systems of forming slots in a semiconductor substrate. In one exemplary embodiment, a slot is formed by cutting with a disk into a semiconductor substrate into one of a first and second surfaces. A trench is created in the semiconductor substrate into the other of the first and second surfaces to form in combination with said cutting a slot through the substrate.