STRUCTURE AND METHOD FOR THERMALLY STRESSING OR TESTING A SEMICONDUCTOR DEVICE

A structure is provided which includes at least one semiconductor device and a diffusion heater in a continuous active semiconductor area of a substrate. One or more semiconductor devices are provided in a first region of the active semiconductor area and a diffusion heater is disposed adjacent ther...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MASSEY JOHN G, XIU KAI, KOLVENBACH KEVIN W, WANG PINGUAN, LA ROSA GIUSEPPE
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!