Thick film conductor compositions and the use thereof in LTCC circuits and devices

The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures there...

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Bibliographische Detailangaben
Hauptverfasser:	MCCOMBS MARK FREDERICK, NAIR KUMARAN MANIKANTAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS INSULATORS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions. The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).