SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

A semiconductor device comprises a main circuit substrate and a plurality of sub-circuit substrates on which a semiconductor element mounted and which are stacked on the main circuit substrate so that mounting surfaces thereof face the main circuit substrate. Each of the sub-circuit substrates has a size larger than a size of the semiconductor element mounted thereon. The semiconductor device comprises a flip chip bonding portion formed between the sub-circuit substrate and the semiconductor element mounted thereon and further comprises adhesive material layers formed between the main circuit substrate and the semiconductor element of a first stage of the sub-circuit substrates and between the semiconductor element of a second or subsequent stage of the sub-circuit substrates and the sub-circuit substrate facing the semiconductor element of the second or subsequent stage of the sub-circuit substrates.