Package structure and manufacturing method thereof
A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a chip and a packing material layer. The substrate has a top surface and a lateral surface. The top surface is connected with the lateral surface. The chip is disposed on the top surface....
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a chip and a packing material layer. The substrate has a top surface and a lateral surface. The top surface is connected with the lateral surface. The chip is disposed on the top surface. The packing material layer comprises a body portion and a extending portion. The body portion covers at least a part of the chip and substrate. The extending portion is connected with the body portion and covers at least a part of substrate. The extending portion is projected to the lateral surface and made from a transparent material. |
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