Plasma etching apparatus and method for forming inner wall of plasma processing chamber

A plasma etching apparatus is provided which can prevent corrosion of an aluminum substrate constituting an etching processing chamber or an inside component thereof, thereby avoiding a reduction in productivity due to scattering of a sprayed coating. In the plasma etching apparatus, an anodic oxide...

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Bibliographische Detailangaben
Hauptverfasser: KADOTANI MASANORI, KAWAGUCHI TADAYOSHI, FURUSE MUNEO, ARAI MASATSUGU, MATANO KATSUJI
Format: Patent
Sprache:eng
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Zusammenfassung:A plasma etching apparatus is provided which can prevent corrosion of an aluminum substrate constituting an etching processing chamber or an inside component thereof, thereby avoiding a reduction in productivity due to scattering of a sprayed coating. In the plasma etching apparatus, an anodic oxide film is disposed between a ceramic sprayed coating with excellent resistance to plasma, and the etching processing chamber and the inside component thereof made of aluminum alloy. The anodic oxide film has a thickness of 5 mum or less to have heat resistance.