INTEGRATED CIRCUIT PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM

An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FILOTEO DARIO S.JR, ILAGAN ALLAN, ABINAN RACHEL L, ESPIRITU EMMANUEL, MERILO LEO A, CABLAO PHILIP L
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.