Semiconductor encapsulating epoxy resin composition and semiconductor device

An epoxy resin composition comprising (A) a mixture of a naphthalene type epoxy resin and an anthracene type epoxy resin, (B) a curing agent in the form of a naphthalene type phenolic resin, and (C) an inorganic filler is best suited for semiconductor encapsulation.

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Bibliographische Detailangaben
Hauptverfasser: KIMURA YASUO, ASANO EIICHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An epoxy resin composition comprising (A) a mixture of a naphthalene type epoxy resin and an anthracene type epoxy resin, (B) a curing agent in the form of a naphthalene type phenolic resin, and (C) an inorganic filler is best suited for semiconductor encapsulation.