Method and apparatus for dissipating heat

A heat dissipation device, comprises a base, a base element positioned within the base, and at least one heat exchange component mounted on the base. The at least one heat exchange component comprises at least one porous foam component (e.g., a metallized foam or a carbon foam), at least one fiber p...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SABATINO MARK, RUZICKA PETER J, EDWARD BRIAN J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	SABATINO MARK RUZICKA PETER J EDWARD BRIAN J
description	A heat dissipation device, comprises a base, a base element positioned within the base, and at least one heat exchange component mounted on the base. The at least one heat exchange component comprises at least one porous foam component (e.g., a metallized foam or a carbon foam), at least one fiber plate (e.g., comprising carbon fibers) and/or at least one corrugated metal element (e.g., comprising aluminum or copper). The device can further comprise at least one sliver (e.g., comprising diamond or carbon fiber). The device can further comprise at least one heat transfer piece (e.g., of diamond) positioned within the base. There is also provided a method of dissipating heat, comprising passing fluid, e.g., air, across at least one heat exchange component of such a device.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2007204972A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2007204972A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2007204972A13</originalsourceid><addsrcrecordid>eNrjZND0TS3JyE9RSMwD4oKCxKLEktJihbT8IoWUzOLizILEksy8dIWM1MQSHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBgbmRgYmlu5GhoTJwqAJxeKZM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and apparatus for dissipating heat</title><source>esp@cenet</source><creator>SABATINO MARK ; RUZICKA PETER J ; EDWARD BRIAN J</creator><creatorcontrib>SABATINO MARK ; RUZICKA PETER J ; EDWARD BRIAN J</creatorcontrib><description>A heat dissipation device, comprises a base, a base element positioned within the base, and at least one heat exchange component mounted on the base. The at least one heat exchange component comprises at least one porous foam component (e.g., a metallized foam or a carbon foam), at least one fiber plate (e.g., comprising carbon fibers) and/or at least one corrugated metal element (e.g., comprising aluminum or copper). The device can further comprise at least one sliver (e.g., comprising diamond or carbon fiber). The device can further comprise at least one heat transfer piece (e.g., of diamond) positioned within the base. There is also provided a method of dissipating heat, comprising passing fluid, e.g., air, across at least one heat exchange component of such a device.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070906&DB=EPODOC&CC=US&NR=2007204972A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070906&DB=EPODOC&CC=US&NR=2007204972A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SABATINO MARK</creatorcontrib><creatorcontrib>RUZICKA PETER J</creatorcontrib><creatorcontrib>EDWARD BRIAN J</creatorcontrib><title>Method and apparatus for dissipating heat</title><description>A heat dissipation device, comprises a base, a base element positioned within the base, and at least one heat exchange component mounted on the base. The at least one heat exchange component comprises at least one porous foam component (e.g., a metallized foam or a carbon foam), at least one fiber plate (e.g., comprising carbon fibers) and/or at least one corrugated metal element (e.g., comprising aluminum or copper). The device can further comprise at least one sliver (e.g., comprising diamond or carbon fiber). The device can further comprise at least one heat transfer piece (e.g., of diamond) positioned within the base. There is also provided a method of dissipating heat, comprising passing fluid, e.g., air, across at least one heat exchange component of such a device.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND0TS3JyE9RSMwD4oKCxKLEktJihbT8IoWUzOLizILEksy8dIWM1MQSHgbWtMSc4lReKM3NoOzmGuLsoZtakB-fWlyQmJyal1oSHxpsZGBgbmRgYmlu5GhoTJwqAJxeKZM</recordid><startdate>20070906</startdate><enddate>20070906</enddate><creator>SABATINO MARK</creator><creator>RUZICKA PETER J</creator><creator>EDWARD BRIAN J</creator><scope>EVB</scope></search><sort><creationdate>20070906</creationdate><title>Method and apparatus for dissipating heat</title><author>SABATINO MARK ; RUZICKA PETER J ; EDWARD BRIAN J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2007204972A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>SABATINO MARK</creatorcontrib><creatorcontrib>RUZICKA PETER J</creatorcontrib><creatorcontrib>EDWARD BRIAN J</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SABATINO MARK</au><au>RUZICKA PETER J</au><au>EDWARD BRIAN J</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and apparatus for dissipating heat</title><date>2007-09-06</date><risdate>2007</risdate><abstract>A heat dissipation device, comprises a base, a base element positioned within the base, and at least one heat exchange component mounted on the base. The at least one heat exchange component comprises at least one porous foam component (e.g., a metallized foam or a carbon foam), at least one fiber plate (e.g., comprising carbon fibers) and/or at least one corrugated metal element (e.g., comprising aluminum or copper). The device can further comprise at least one sliver (e.g., comprising diamond or carbon fiber). The device can further comprise at least one heat transfer piece (e.g., of diamond) positioned within the base. There is also provided a method of dissipating heat, comprising passing fluid, e.g., air, across at least one heat exchange component of such a device.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US2007204972A1
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
title	Method and apparatus for dissipating heat
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T20%3A41%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SABATINO%20MARK&rft.date=2007-09-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2007204972A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true