Method and apparatus for dissipating heat

A heat dissipation device, comprises a base, a base element positioned within the base, and at least one heat exchange component mounted on the base. The at least one heat exchange component comprises at least one porous foam component (e.g., a metallized foam or a carbon foam), at least one fiber p...

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Bibliographische Detailangaben
Hauptverfasser:	SABATINO MARK, RUZICKA PETER J, EDWARD BRIAN J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	A heat dissipation device, comprises a base, a base element positioned within the base, and at least one heat exchange component mounted on the base. The at least one heat exchange component comprises at least one porous foam component (e.g., a metallized foam or a carbon foam), at least one fiber plate (e.g., comprising carbon fibers) and/or at least one corrugated metal element (e.g., comprising aluminum or copper). The device can further comprise at least one sliver (e.g., comprising diamond or carbon fiber). The device can further comprise at least one heat transfer piece (e.g., of diamond) positioned within the base. There is also provided a method of dissipating heat, comprising passing fluid, e.g., air, across at least one heat exchange component of such a device.