Electronic component package

The present invention is to prevent melted sealant from flowing into the interior of a case of an electronic component package that is provided with a shielding electrode on the inner surface of the case, fill a through-hole with the sealant with reliability, and perform vacuum airtight sealing. The electronic component package 10 has a case 12 that has an opening and stores an electronic component (piezoelectric oscillator 11 ) in the storage inside, and a lid 16 that is joined to the rim of the opening to cover the opening, and airtightly seals a through-hole 20 provided on the bottom part 12 b of the case 12 to communicate with the outside, by using a sealant 30 . The electronic component package is provided with a shielding electrode 15 on the inner surface of the case to remove a noise influence, and further provided with a configuration to set a part (nonmetal part 22 ) between the through-hole 20 and the shielding electrode 15 , the part being low in wettability with the melted sealant 30 , thereby making it difficult to flow the melted sealant 30 from the through-hole 20 into the case 12 along the shielding electrode 15 , preventing the melted sealant 30 from flowing into the case 12.